| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board capable of manufacturing a multi-layer board in manufacturing steps as few as possible, which has a high degree of integration and a high degree of designing during mounting a component, and such a printed wiring board. SOLUTION: A printed wiring board 46 includes an insulating substrate 43; first and second wiring layers 41a and 44a provided on both sides of the insulating substrate 43; and bumps 42 composed of dielectric composition or resistance composition, connecting between the first and second wiring layers 41a and 44a in the thickness direction of the insulating substrate 43, and forming a passive element between the both wiring layers 41a and 44a. COPYRIGHT: (C)2007,JPO&INPIT
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