| 摘要 |
A stackable package substrate having a generally centrally-located opening shaped and dimensioned to accommodate a mold cap of a package upon which the stackable package is to be mounted. Accordingly, the substrate has the form of a frame surrounding an opening. On the die attach surface the frame substrate accommodates a marginal die attach margin adjacent at least part of the edge of the opening; and at least one row of wire bond sites arranged or arrayed along at least one outer frame edge, for electrical interconnection of die mounted on the frame. On the surface opposite the die attach surface, the frame substrate accommodates at least one row of z-interconnect ball pads arranged or arrayed to align with corresponding z-interconnect pads on the substrate of a package on which the stackable package is to be mounted. Also, a stackable package has such a frame substrate. Also, a stacked package assembly includes a second package mounted on a first package using peripheral solder ball z-interconnect, in which the first package includes at least one die enclosed by a mold cap and in which the second package includes at least one die mounted on a frame substrate. The opening in the substrate is shaped and dimensioned to accommodate the mold cap on the bottom package when the packages are mounted; that is, in the assembly the mold cap protrudes into the space made available within the opening in the frame substrate.
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