| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor integrated circuit device that can realize high-reliability semiconductor integrated circuit device, and to provide a method for manufacturing the semiconductor integrated circuit device. SOLUTION: The apparatus is used to manufacture a semiconductor integrated circuit device, wherein a first semiconductor device 1A and a second semiconductor device 1B having external connection terminals 2 are stacked by means of solder balls 3 mounted to the external connection terminals 2. The apparatus is provided with a movable pin 5 whose lower end is fitted onto the main surface of a jig 4, spacers 6, 7 and 8, which are provided on the jig 4 and are fixed by inserting the movable pins 5 into their inside, and a fixing jig 9 for fixing the spacers. The movable pin 5 is movable in the circumference direction with the lower end as the center, depending on the size of a semiconductor substrate 1b; while the lower end is movable in the horizontal direction to the main surface of the jig 4, and first thrugh fifth spacers (6a, 7a, 8, 7b, and 6b) have shapes, corresponding to the size of the semiconductor substrate 1b. COPYRIGHT: (C)2007,JPO&INPIT
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