| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer which can absorb a difference in thermal expansion between a semiconductor device and a substrate, an electronic device having the interposer and its cooling method, and a method of mounting a semiconductor device using the interposer. SOLUTION: The interposer 3 is provided between a substrate 1 and a semiconductor chip 2 in an electronic device 100, and it includes a PTFE substrate 30 which is comprised of an PTFE made of a porous resin and has an opening 32 at the corresponding position to the substrate 1 and the semiconductor chip 2, and a connection part 31 provided within the opening 32. COPYRIGHT: (C)2007,JPO&INPIT
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