| 摘要 |
PROBLEM TO BE SOLVED: To provide multilayer interconnection incorporating a fined capacitor. SOLUTION: The multilayer interconnection 10 comprises first metal wiring 2, an interlayer insulating film 3, a dielectric post 4, and second metal wiring 5. The first metal wire 2, the interlayer insulating film 3, the dielectric post 4, and the second metal wire 5 are all formed by screen printing. The first metal wire 2 is formed on one surface 1A of a substrate 1. The dielectric post 4 passes through the interlayer insulating film 3, and is formed on the first metal wiring 2 so that a tip section 4A projects from one main surface 3A of the interlayer insulating film 3. The second metal wiring 5 is formed on the interlayer insulating film 3 so that the tip section 4A of the dielectric post 4 is covered. COPYRIGHT: (C)2007,JPO&INPIT
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