| 摘要 |
A printed circuit board ( 120 ) includes an insulating substrate ( 120 a) on which conductive films ( 120 b) are formed. Semiconductor devices ( 8 ) disposed external to the printed circuit board ( 120 ) have their leads ( 24 a, 24 b, 24 c) connected to the conductive films. A flexible portion ( 30 ) is formed in the insulating substrate ( 120 a) at a location near the location where the leads ( 24 a, 24 b, 24 c) are connected to the conductive films ( 120 b).
|
