发明名称 BONDING BY INDUCED HIGH-RATE OF SHEAR DEFORMATION
摘要 The bonding method and apparatus (20) includes a delivering of a target web (26) having one or more selected bonding materials through a nip region (30) between at least one cooperating pair of rotatable bonding rollers (32, 34), thereby forming and producing a bonded web (28). In a particular aspect, a pattern roller (32) can be configured to provide a distinctively high, pattern surface speed. In another aspect, the pair of bonding rollers can be configured to provide a distinctively low, bonding pressure value. In further aspects, an anvil roller (34) can be provided with an anvil surface speed, and the anvil surface speed can be configured to be substantially equal to the pattern surface speed.
申请公布号 WO2006127075(A1) 申请公布日期 2006.11.30
申请号 WO2006US06572 申请日期 2006.02.23
申请人 KIMBERLY-CLARK WORLDWIDE, INC.;SENAPATI, NAGABHUSAN;ZHUANG, SHIMING 发明人 SENAPATI, NAGABHUSAN;ZHUANG, SHIMING
分类号 B29C65/00;B29C65/02;B29C65/06;B29C65/56;B31F5/02 主分类号 B29C65/00
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