FLEXIBLE METAL CLAD LAMINATE WITHOUT ADHESION AND METHOD OF MANUFACTURING FLEXIBLE METAL CLAD LAMINATE WITHOUT ADHESION

摘要

Flexible metal clad laminate without adhesive is provided to prevent bending of the laminate caused by difference of contraction and tensile strength between layers of the laminate by constantly maintaining dimension ratio of crystal sizes between two metal layers such as metal seed layer and metal conductive layer which are vapor deposited to the top of a polymer film. The laminate comprises: a polymer film(10) as a raw material of a flexible circuit board; a metal seed layer(20) that is formed on the top of the polymer film by vacuum film formation processes such as sputtering, vacuum vapor deposition or ion plating, and has average crystal size ranging from 0.01 to 0.05 micrometers; and a metal conductive layer(30) that is formed on the top of the metal seed layer by electrolysis plating process and has average crystal size ranging from 0.1 to 3.0 micrometers. Dimension ratio of the crystal sizes of the metal seed layer to the metal conductive layer ranges from 0.015 to 0.5. The metal seed layer is formed by using metal target such as nickel-chromium alloy, copper or copper alloy.