| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which hardly has warping deformation and hence can reduce the variation in radiant intensity, axial direction luminous intensity, brightness, color rendering property, etc. of a light emitting device; and also to provide a package for storing the light emitting element, light emitting device, and lighting system using the same. <P>SOLUTION: In the substrate 1 for mounting the light emitting element, a mounting pad 3 to which an electrode of the light emitting element 6 is electrically connected is formed on the upper principal plane and a conductor layer 4 is formed on the lower principal plane, and a connection conductor 5 for electrically connecting the mounting pad 3 and the conductor layer 4 is also formed. The conductor layer 4 is surrounded by a metal layer 40 partitioned into a plurality of portions by slit-like portions 41 wherein the metal layer 40 does not exist. Since the conductor layer 4 and the metal layer 40 are partitioned into small areas, the substrate 1 for mounting the light emitting element hardly has warping deformation and thereby heat can be transmitted efficiently to an external electric circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT |
