| 摘要 |
PROBLEM TO BE SOLVED: To prevent a failure from being caused by the adhesion of scrap. SOLUTION: A heat-conduction area reducing part 35 for reducing a heat-conduction area between a runner inserting piece 28, and a fixed mold 21 or a movable mold 22, corresponding to the piece 28 is provided between both of them. Thus, after the cooling of a resin molding 23, the resin molding 23 can be protruded while a runner 26 is in a softened state. COPYRIGHT: (C)2007,JPO&INPIT
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