| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered mold release film capable of suppressing the occurrence of voids during hot press molding, the outflow of an adhesive and the bleeding of the resin of a cushioning layer from the end surface of a film while having heat resistance, mold releasability and the followability to the surface of a substrate. SOLUTION: The multilayered mold release film has at least a mold release layer comprising a crystalline aromatic polyester resin of which the melting point measured using a differential scanning calorimeter is 200°C or above and the cushioning layer comprising a polyolefinic resin of which the melting point measured using the differential scanning calorimeter is 70-130°C. The thickness of the mold release layer is 5-30μm, the thickness of the cushioning layer is 30-150μm and the thickness ratio of the mold release layer to the cushioning layer is 1:2-1:10. COPYRIGHT: (C)2007,JPO&INPIT
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