摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered mold release film causing no ply separation at mold release, excellent in heat resistance, mold releasability and the followability to the surface of a substrate and capable of suppressing the occurrence of voids during hot press molding, the outflow of an adhesive and the bleeding of the resin of a cushioning layer from the end surface of a film. SOLUTION: The multilayered mold release film has at least a mold release layer comprising a thermoplastic saturated polyester resin of which the melting point measured using a differential scanning calorimeter is 200°C or above and the cushioning layer of which the melting point measured using the differential scanning calorimeter is 70-130°C. The cushioning layer contains straight chain low density polyethylene, which is obtained by copolymerizing ethylene and a≥6Cα-olefin, as a main component. COPYRIGHT: (C)2007,JPO&INPIT
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