Manufacturing method for an electronic component assembly and corresponding electronic component assembly

摘要

Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly. The method comprises the steps of: providing a substrate having a first and a second side and having at least one through-hole, said second side having a first plurality of solder connection pads; attaching a semiconductor chip to said first side of said substrate; performing a mould process on said substrate and said attached semiconductor chip so as to obtain a mould package, said mould package including at least one first mould section covering said semiconductor chip on the first side and at least one second mould section extending through said throughhole and protruding over said solder connection pads on the second side; and providing a printed circuit board having a surface with a second plurality of solder connection pads corresponding to said first plurality of solder connection pads; and soldering said mould package to said printed circuit board by means of solder balls between said first and second plurality of solder connection pads such that said at least one second section forms a spacer structure supporting said mould package on said surface of said printed circuit board.