发明名称 |
OPTIMIZED THERMALLY CONDUCTIVE PLATE AND ATTACHMENT METHOD FOR ENHANCED THERMAL PERFORMANCE AND RELIABILITY OF FLIP CHIP ORGANIC PACKAGES |
摘要 |
Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
|
申请公布号 |
US2006268521(A1) |
申请公布日期 |
2006.11.30 |
申请号 |
US20050908796 |
申请日期 |
2005.05.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COFFIN JEFFREY T.;GAYNES MICHAEL A.;QUESTAD DAVID L.;SIKKA KAMAL K.;TOY HILTON T.;WAKIL JAMIL A. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|