| 摘要 |
A semiconductor module and a heat sink for the semiconductor module are provided to improve the easiness of a module assembling process by using a fixing member. A semiconductor module comprises a circuit board(11), a semiconductor element(17) mounted on both sides of the circuit board, and heat sinks. The heat sink(12a,12b) are installed at both sides of the, circuit board respectively. The heat sink is used for enclosing the semiconductor element. The circuit board has a connection hole capable of attaching the heat sink. The heat sink includes a connection corner portion corresponding to the connection hole of the circuit board. A fixing member(20) is formed at a connection corner portion of the heat sink. The fixing member and the heat sink are formed as one piece. |
