发明名称 MICROWAVE SINTERING APPARATUS AND METHOD FOR MANUFACTURING AN EMBEDED CAPACITOR CIRCUIT BOARD USING THE SAME
摘要 A microwave sintering apparatus and a method for manufacturing a capacitor embedded circuit board using the same are provided to enhance a sintering density and a dielectric ratio by a self volume heat-emission of a ceramics by leading a hybrid rapid sintering. A method for manufacturing capacitor embedded circuit board includes the steps of: forming a first electrode by mounting a conductive metal at one side of an inner layer(S201); forming a thick film at the first electrode by using a thick film oxide material(S203); sintering the think film by a micro wave(S204); and forming a second electrode at the sintered thick film oxide(S205).
申请公布号 KR20060122254(A) 申请公布日期 2006.11.30
申请号 KR20050044573 申请日期 2005.05.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AHN, JIN YONG;CHO, SUK HYEON;KIM, JOON SUNG
分类号 H05K1/16 主分类号 H05K1/16
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