Fabrication method of two-piece type semiconductor package,申请号KR20000079732-传众专利搜索

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发明名称	Fabrication method of two-piece type semiconductor package
摘要
申请公布号	KR100651801(B1)	申请公布日期	2006.11.30
申请号	KR20000079732	申请日期	2000.12.21
申请人		发明人
分类号	H01L23/13	主分类号	H01L23/13
代理机构		代理人
主权项
地址

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