| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pad plate to be easily controlled. <P>SOLUTION: An adapter 7 is fitted to a dummy rotary platen 6 by a bolt or the like, and a hole 8 is bored at the center of these parts. The hole 9 for a vacuum suction is formed. A throwaway polishing pad plate 1 is vacuum-sucked and fixed by the adapter 7. A polishing pad 3 for the throwaway polishing pad plate 1 is ground in an accuracy required for a CMP polishing by a grinder 11. A parallelism in the required accuracy to the surface of the adapter 7 is kept on the grinding surface of the grinder 11 in this case, and it is desirable that the grinding surface of the grinder 11 has no gimbal mechanism. Accordingly, the surface of the ground polishing pad 3 has the sufficient parallelism to the adapter 7, thus keeping the sufficient parallelism to the surface of the adapter for a CMP polisher when the pad plate is used actually. <P>COPYRIGHT: (C)2007,JPO&INPIT |
