| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad, hardly causing scratch on the surface of a polishing object and having excellent flattening characteristic, and a method of manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: This polishing pad 1 includes a polishing layer formed of polyurethane resin foam having micro cells, wherein the polishing surface of the polishing layer has a projecting and recessed structure. The polyurethane resin foam has a tensile breaking elongation of 25 to 120%. <P>COPYRIGHT: (C)2007,JPO&INPIT |
