| 摘要 |
PROBLEM TO BE SOLVED: To uniformly feed material gases in a chamber regarding a shower plate for feeding various gases to a surface wave excited plasma processing chamber and a surface wave excited plasma processing device using the shower plate. SOLUTION: The surface wave excited plasma processing device 100 is provided with a shower plate 10 for introducing material gases into a chamber. The shower plate 10 has a planar shape as a whole, and has a first chamber 11 and a second chamber 12 each having a hollow structure at the upper and lower two steps. The material gases are introduced from a gas introduction port 14 into the first chamber 11, are transferred to the second chamber 12 through a plurality of gas blow holes 11b perforated in a dispersion plate 11a, and are released into the chamber 1 through a plurality of gas blow holes 12b perforated in the dispersion plate 12a. At this time, by providing the gas blow holes 11b, 12b in multistages, the material gases can be uniformly fed to the substrate S to be treated. Thus, the uniformity of plasma processing improves as well. COPYRIGHT: (C)2007,JPO&INPIT
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