| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of packaging a semiconductor chip capable of omitting a process for inspecting the gap between the semiconductor chip and a circuit board after packaging the semiconductor chip, and capable of reducing working hours. SOLUTION: In the method for packaging the semiconductor chip, the semiconductor chip is arranged on the circuit board, heat treatment is performed while a load is applied to the semiconductor chip by a packaging nozzle, and then the packaging nozzle is moved so that the gap between the semiconductor chip and the circuit board is reduced. In the packaging method, it is determined whether the value of the load applied to the semiconductor chip is a prescribed load value or smaller for determining quality in the packaging of the semiconductor chip. COPYRIGHT: (C)2007,JPO&INPIT
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