PIEZOELECTRIC DEVICE

摘要

A piezoelectric device which can be efficiently manufactured. A cover substrate (20) is bonded along the periphery of an element substrate (12) whereupon a piezoelectric element is formed, and the piezoelectric element is sealed. The main plane of the cover substrate (20) is provided with an external terminal (26) having solder as the main component, and an outermost layer (25) made of resin to cover portions other than the external terminal (26). A first assembled substrate to be the element substrate (12) of a plurality of piezoelectric devices (10) and a second assembled substrate to be the cover substrate (20) of the piezoelectric devices (10) are bonded so that each element substrate (12) and each cover substrate (20) are bonded, and then the bonded assembled substrates are cut along a cutting line into independent piezoelectric devices (10). On the second assembled substrate before cutting, a resin layer to be an outermost layer (25) is formed on the plane opposite to the plane whereupon the first assembled substrate is to be bonded. On the resin layer, a cutting section having no resin is formed along the cutting line before the second assembled substrate is cut.