| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for rapidly heating semiconductor wafer which can rapidly heat a semiconductor wafer without breaking it nor causing it to jump up and down even if rapidly heating the wafer using flash lamps. SOLUTION: The device for rapidly heating semiconductor wafer comprises a light source 2 consisting of the plurality of flush lamps 5 arranged in parallel, and a reflection plate 6 which reflects the light emitted from the flush lamps 5 toward the object to be heated, and a heat treatment chamber 3 wherein a support base 10 for supporting the semiconductor wafer W is arranged. The support base 10 is formed with a concave portion on the front surface. When the semiconductor wafer W is so arranged as to cover the concave portion, there is a space generated between the support base 10 and the semiconductor wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
