| 摘要 |
PROBLEM TO BE SOLVED: To provide a new structure epoxy(meth)acrylate compound, and to provide a photocurable and/or thermosetting resin composition containing the epoxy(meth)acrylate compound. SOLUTION: The epoxy(meth)acrylate compound (A) is prepared by reacting an unsaturated group-containing monocarboxylic acid (b) with a modified epoxy compound (a) having two epoxy groups in the molecule and obtained by reacting en epoxy compound (a-iii) having two or more epoxy groups in the molecule with a modified dicarboxylic acid compound obtained from a tribasic acid or tetrabasic acid anhydride (a-i) and a monoalcohol (a-ii). The photocurable and/or thermosetting resin composition contains the epoxy(meth)acrylate compound (A), a radical polymerization initiator (B) and a diluent (C) as essential components. COPYRIGHT: (C)2007,JPO&INPIT
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