| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module by which a failure of damaging rectifier cells by fire etc. is eliminated by suppressing the temperature difference between respective elements in the case of electrically and thermally connecting a plurality of the rectifier cells to be connected in parallel. SOLUTION: The semiconductor module 7U is provided with a plurality of switching elements 3U-1 to 3U-3 and 4U-1 to 4U-3 connected in parallel, and a plurality of the rectifier cells 5U-1 to 5U-3, 6U-1 to 6U-3 connected in parallel. High thermally conductive members 13 and 14 are provided and connected on a surface including one terminal of the plurality of the rectifier cells connected in parallel, to electrically and thermally connect the rectifier cells with each other to constitute the semiconductor module. COPYRIGHT: (C)2007,JPO&INPIT
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