| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having via holes without occurrences of an exfoliation at an interface between the board and a conductive member, and also without a trouble caused by a thermal stress of the board crack or the like, and also to provide its manufacturing method. SOLUTION: The wiring board has a via hole 4 formed through between one surface 1a and the other surface 1b of the board 1 comprising a hourglass-shaped through hole 2 with its inside diameter at the central part in a thickness direction of the board 1 smaller than the diameter of the openings at the surfaces 1a, 1b; and a layer of a conductive member 3 covering whole inside face of the through hole 2 with its ends of the both end openings of the through hole 2 exposed and with the central part of the through hole 2 blocked up. COPYRIGHT: (C)2007,JPO&INPIT
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