| 摘要 |
An integrated-circuit die includes a number of signal paths, and includes a greater number of signal pads that are operable to be coupled to the signal paths. By including more signal pads than signal paths on the die, one can often repair a defect in the connection of a pad to, e.g., a pad of another die, by connecting a signal path to another, i.e., redundant, pad. And such repairing of a pad-connection defect can often increase the yield of the integrated circuits incorporating such a die and/or can extend the lifetime of such an integrated circuit.
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