发明名称 Wireless device enclosure using piezoelectric cooling structures
摘要 An enclosure for a wireless device includes a first compartment and a second compartment. The first compartment is to house some or all of the electronic circuitry of the wireless device and is sealed from an exterior environment. The second compartment is adjacent to the first compartment and includes one or more piezoelectric fans to provide cooling for the first compartment. The second compartment is open to the exterior environment and provides physical protection for the one or more piezoelectric fans located therein.
申请公布号 US2006268534(A1) 申请公布日期 2006.11.30
申请号 US20050140769 申请日期 2005.05.31
申请人 INTEL CORPORATION 发明人 PAYDAR REZA;SAUCIUC IOAN
分类号 H05K5/02 主分类号 H05K5/02
代理机构 代理人
主权项
地址