| 摘要 |
A polishing pad and a CMP apparatus using the same are provided to improve polishing speed and polishing uniformity by forming uniformly dispersion of slurries. A first groove pattern(400) having a concentric shape is formed on a surface of a polishing pad. A second groove pattern(410) is formed spirally on the surface of the polishing pad from a center part of the concentric shape of the first groove pattern to the outside to be overlapped with the first groove pattern. A third groove pattern is formed radially on the surface of the polishing pad from the center part of the concentric shape of the first groove pattern to be overlapped with the first and the second groove pattern.
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