发明名称 |
RECONFIGURABLE PROCESSOR MODULE WITH STACKED DIE ELEMENTS |
摘要 |
<p>A reconfigurable processor module comprising hybrid stacked integrated circuit ("IC") die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array ("FPGA") die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.</p> |
申请公布号 |
EP1726042(A2) |
申请公布日期 |
2006.11.29 |
申请号 |
EP20040814029 |
申请日期 |
2004.12.14 |
申请人 |
ARBOR COMPANY LLP |
发明人 |
HUPPENTHAL, JON, M.;GUZY, JAMES D. |
分类号 |
H01L23/02;G06F15/78;H01L21/50;H01L21/98;H01L25/065;H01L25/18 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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