发明名称 |
A METHOD FOR USING PLASMA ETCHING EQUIPMENT |
摘要 |
A method for using a plasma etching apparatus is provided to prevent inflow of dust or pollutants into a gap between electrodes by sealing the gap between the electrodes by lowering a shroud ring. An assembling process is performed to assemble a plasma etching apparatus(S100). An upper electrode is moved to a lower direction to move a shroud ring located on the upper electrode to a predetermined position lower than a surface of a lower electrode(S200). An inner part of the process chamber is formed in a high vacuum state by using a vacuum pump connected with a process chamber(S300). A gap between the upper electrode and the lower electrode is 4 cm to 1 cm.
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申请公布号 |
KR20060121599(A) |
申请公布日期 |
2006.11.29 |
申请号 |
KR20050043851 |
申请日期 |
2005.05.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, KWANG WOO |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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