发明名称 A METHOD FOR USING PLASMA ETCHING EQUIPMENT
摘要 A method for using a plasma etching apparatus is provided to prevent inflow of dust or pollutants into a gap between electrodes by sealing the gap between the electrodes by lowering a shroud ring. An assembling process is performed to assemble a plasma etching apparatus(S100). An upper electrode is moved to a lower direction to move a shroud ring located on the upper electrode to a predetermined position lower than a surface of a lower electrode(S200). An inner part of the process chamber is formed in a high vacuum state by using a vacuum pump connected with a process chamber(S300). A gap between the upper electrode and the lower electrode is 4 cm to 1 cm.
申请公布号 KR20060121599(A) 申请公布日期 2006.11.29
申请号 KR20050043851 申请日期 2005.05.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, KWANG WOO
分类号 H01L21/3065 主分类号 H01L21/3065
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