A method for local wafer thinning and reinforcement

摘要

A method is provided for preparing a semiconductor wafer (500) for testing. The method includes selecting a die (525) to be tested; measuring a diagonal of the die; thinning an area (550) over the die extending beyond the scribe lines (520a,520b), the thinned area may be a circular area having a diameter that is larger than the measured diagonal; providing an insert (560) inside the thinned area; and providing an adhesive (580) on the peripheral area of the insert so as not to obscure the optical path to the die. The insert (560) is advantageously made of an undoped silicon.