| 摘要 |
<p>A siloxane resin exhibiting high transparency at a wavelength of 193 nm or less, very suitable as a resin component in a radiation-sensitive resin composition useful particularly for manufacturing LSIs, and a radiation-sensitive resin composition useful as a chemically-amplified resist exhibiting excellent depth of focus (DOF) and capability of remarkably decreasing development defects are provided. The siloxane resin comprises the structural unit (I) shown by the following formula (I) and the structural unit (II) shown by the following formula (II) in the same molecule, the structural unit (I) and the structural unit (II) being included in an amount of more than 0 mol% but not more than 70 mol%,
wherein A and B individually represents a divalent linear, branched, or cyclic hydrocarbon group, R 1 represents a monovalent acid-dissociable group, and R 2 represents a linear, branched, or cyclic alkyl group. The radiation-sensitive resin composition comprises (a) the siloxane resin and (b) a photoacid generator.</p> |
