FLIP-CHIP LIGHT EMITTING DIODE DEVICE WITHOUT SUB-MOUNT

摘要

A light emitting diode ( 10 ) has a backside and a front-side with at least one n-type electrode ( 14 ) and at least one p-type electrode ( 12 ) disposed thereon defining a minimum electrodes separation (d_electrodes). A bonding pad layer ( 50 ) includes at least one n-type bonding pad ( 64 ) and at least one p-type bonding pad ( 62 ) defining a minimum bonding pads separation (d_pads) that is larger than the minimum electrodes separation (d_electrodes). At least one fanning layer ( 30 ) interposed between the front-side of the light emitting diode ( 10 ) and the bonding pad layer ( 50 ) includes a plurality of electrically conductive paths passing through vias ( 34, 54 ) of a dielectric layer ( 32, 52 ) to provide electrical communication between the at least one n-type electrode ( 14 ) and the at least one n-type bonding pad ( 64 ) and between the at least one p-type electrode ( 12 ) and the at least one p-type bonding pad ( 62 ).