| 摘要 |
A method for manufacturing a multi-layer PCB is provided to give interlayer position registration by collectively coupling inner layer cores comprising the multi layer substrate through a staple. A method for manufacturing a multi-layer PCB includes the steps of: laminating a plurality of inner layer cores by inserting a bonding sheet alternately, forming a hole(10) around the inner layer cores and the bonding sheet, and laminating the inner cores and the bonding sheet alternately while fixing the inner layer cores and the boding sheet to a guide pin by penetratingly fixing the hole to the guide pin; bonding the plurality of inner layer cores with the boding sheet by sticking a staple on a selected point of an edge circumference with respect to a combination of the plurality of inner layer cores and the bonding sheet laminated/arranged at the guide pin; separating the multi-layer PCB consisting of the plurality of inner layer cores and the bonding sheet, bonded each other, from the guide pin; unifying the multi-layer PCB by melting an interlayer of the inner layer cores by molding the multi-layer PCB; and cutting/removing a circumference part of the multi-layer PCB, where the staple is stuck.
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