发明名称 In-situ profile measurement in an electroplating process
摘要 <p>A method and apparatus for measuring differential voltages in an electrolyte of an electrochemical plating cell. Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials. A real time thickness profile may be generated from the thickness values.</p>
申请公布号 EP1726690(A2) 申请公布日期 2006.11.29
申请号 EP20060252725 申请日期 2006.05.25
申请人 APPLIED MATERIALS, INC. 发明人 BIRANG, MANOOCHER;KOVARSKY, NICOLAY;ROSENFELD, ARON
分类号 C25D21/12;C25D7/12;G01B7/06;H01L21/00 主分类号 C25D21/12
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