| 发明名称 |
LAND GRID ARRAY TYPE PACKAGE |
| 摘要 |
<p>A land grid array package having a structure wherein a device-side ground electrode (6) and a substrate-side ground electrode (9), and a device-side peripheral electrode (7) and a substrate-side peripheral electrode (10) are respectively soldered with an eutectic solder (16) is characterized in that a gas vent through hole (15) penetrating a mounting substrate (3) is formed in a soldering region (18) of the device-side ground electrode (6). In this land grid array package, short circuit and disconnection can be suppressed.</p> |
| 申请公布号 |
KR20060121080(A) |
申请公布日期 |
2006.11.28 |
| 申请号 |
KR20057008809 |
申请日期 |
2005.05.17 |
| 申请人 |
SANYO ELECTRIC CO., LTD.;SANYO TUNER INDUSTRIES CO., LTD. |
发明人 |
SUZUKA TAKUYA |
| 分类号 |
H01L21/60;H01L23/12;H05K3/34 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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