| 摘要 |
<p>A semiconductor memory card and a manufacturing method thereof are provided to prevent defects due to separation of a mold resin from a lateral face of a substrate by increasing coherence between a substrate and the mold resin. A wiring substrate(11) comprises a first surface, a second surface facing the first surface, a plurality of external connective terminals, and a plurality of wiring lines(12) formed on the first surface. A protective layer is formed on the second surface of the wiring substrate and has an opening in at least part of an outer periphery of the wiring substrate. A memory chip(17) is mounted on the second surface of the wiring substrate. A resin layer is used for composing a package of a semiconductor memory card by sealing a side of the second surface of the wiring substrate to cover the protective layer and the memory chip.</p> |
