| 摘要 |
A transfer apparatus in a semiconductor fabrication is provided to transfer quickly a semiconductor substrate by using a distance adjusting unit. A transfer apparatus in a semiconductor fabrication includes a body structure and a distance adjusting unit. The body structure(210) is composed of a first body(211a) and a second body(211b). The first and second bodies include a first and second guide grooves, respectively. The first and second guide grooves are spaced apart from each other in order to fix a semiconductor substrate. The distance adjusting unit(220) is installed at the body structure. The distance adjusting unit is used for controlling the distance between the first and second bodies.
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