Module with a built-in semiconductor and method for producing the same

摘要

In a module with a built-in semiconductor, higher densification is achieved by disposing inner vias close to a semiconductor device. A module which has a space ( 107 ) between a first wiring layer ( 102 a) and a built-in semiconductor device ( 105 ). The module is obtained by: mounting the semiconductor device ( 105 ) on a first wiring layer ( 102 a) of a wiring board ( 103 ) without using a sealing resin; stacking on the circuit board an electrically insulating substrate having a through bore (inner via) ( 104 ) filled with a conductive paste and an opening for receiving the semiconductor device, and a mold release carrier having a second wiring layer ( 102 b) in the stated order; and heating and pressurizing so that the semiconductor device ( 105 ) is incorporated in a core layer ( 101 ) which is formed by curing the electrically insulating substrate.