SIP TYPE PACKAGE CONTAINING ANALOG SEMICONDUCTOR CHIP AND DIGITAL SEMICONDUCTOR CHIP STACKED IN ORDER, AND METHOD FOR MANUFACTURING THE SAME

摘要

A SIP type package containing an analog semiconductor chip and a digital semiconductor chip stacked in order, and a method for manufacturing the same are provided to reduce size and weight thereof by improving its structure. A semiconductor package comprises a wiring board(40) having a ground layer(54) formed therein, an analog semiconductor chip(53) provided on the ground layer, and a digital semiconductor chip(50) provided on the analog semiconductor chip. A substrate(50A) of the digital semiconductor chip is directed toward the analog semiconductor chip. The analog semiconductor chip is formed with a radio frequency signal processing semiconductor chip. The digital semiconductor chip is formed with a baseband signal processing semiconductor chip.