发明名称 |
CAPACITOR CIRCUIT-ATTACHED FILM CARRIER TAPE AND ITS MANUFACTURING METHOD, AND CAPACITOR CIRCUIT-ATTACHED SURFACE-MOUNTING FILM CARRIER TAPE AND ITS MANUFACTURING METHOD |
摘要 |
A capacitor circuit-attached film carrier tape and a manufacturing method thereof, and a capacitor circuit-attached surface-mounting film carrier tape and a manufacturing method thereof are provided to enhance flexibility by forming a capacitor circuit and a circuit shape of a terminal pad on a resin film. A film carrier tape with a capacitor circuit comprises a wiring pattern on a surface of a resin film(2) having a plurality of sprocket holes(9) formed at both ends. The resin film includes solder ball land holes(10). The wiring pattern includes a capacitor circuit having a structure in which a dielectric layer(7) is formed between an upper electrode and a lower electrode. A cover film is formed to expose partially a surface of the upper electrode of the capacitor circuit and the other wiring patterns of the capacitor circuit. Each of the exposed parts is used as a solder ball land hole.
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申请公布号 |
KR20060120475(A) |
申请公布日期 |
2006.11.27 |
申请号 |
KR20060045002 |
申请日期 |
2006.05.19 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MASHIKO YASUAKI |
分类号 |
H01L21/50;H01L21/60 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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