| 摘要 |
<p>A circuit board, a mounting structure of a semiconductor device having a bump, an electro-optical device, and an electronic apparatus are provided to diminish an occurrence of short by setting a ratio(P1/P2) of a P1 which is a pitch of a large side pad, and a P2 which is a pitch of a small side pad, in a range of 1.01 to 3. In a circuit board, a plurality of blocks is arranged at a substrate, wherein a plurality of pads(413a) is arranged at the blocks. The plurality of blocks is formed to be different in a vertical direction pad pitch and a horizontal direction pad pitch each other. A space is formed between the plurality of blocks. The space is formed to be bigger than the vertical direction pad pitch or the horizontal direction pad pitch. A plurality of wirings(411) is drawn toward a bigger side between the vertical and horizontal direction pitches of the plurality of pads(413a), and also a portion thereof is configured to route the space.</p> |
