发明名称 |
A METHOD OF FORMING A TEOS CAP LAYER AT LOW TEMPERATURE AND REDUCED DEPOSITION RATE |
摘要 |
<p>The present invention discloses a method for forming a silicon dioxide cap layer for a carbon hard mask layer for the patterning of polysilicon line features having critical dimensions of 50 nm and less. To this end, a low temperature plasma- enhanced CVD process is used, in which the deposition rate is maintained low to provide improved controllability of the layer thickness and, thus, of the optical characteristics of the silicon dioxide layer.</p> |
申请公布号 |
KR20060120630(A) |
申请公布日期 |
2006.11.27 |
申请号 |
KR20067004086 |
申请日期 |
2006.02.27 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
RUELKE HARTMUT;HUY KATJA;ROMERO KARLA |
分类号 |
H01L21/027;C23C16/40;H01L21/033;H01L21/31;H01L21/316;H01L21/3213 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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