发明名称 APPARATUS AND METHOD FOR LASER BEAM MACHINING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for laser beam machining, by which apparatus and method, a dividing operation can be performed by exactly setting a dividing position without leaving machined traces on the surface of a workpiece and without causing fusion on the surface of the workpiece and cracks deviated from a planned cut-off line. <P>SOLUTION: The apparatus and the method for laser beam machining are configured such that a reformed portion 18 to be divided is formed inside the vicinity of the surface of the workpiece 12 on the side irradiated by a laser beam L1 by performing a power adjustment of the laser beam L radiated from a laser beam source 1 and by radiating the pulse laser beam L1 via a condenser lens 8 for converging the pulse laser beam L1 along a planned dividing portion 17 on the workpiece 12, which is fixed to workpiece fixing means 13, 14, 15, 16 and transmits the laser beam L1. The workpiece fixing means 14 is provided with a distance measuring device 11 for measuring the distance between the condenser lens 8 and the workpiece 12. The posture of the workpiece 12 is measured by means of the distance measuring device. The reformed portion is formed by making the light converged point of the condenser lens 8 coincide with a required position based on the measured information. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006315031(A) 申请公布日期 2006.11.24
申请号 JP20050139987 申请日期 2005.05.12
申请人 SONY CORP 发明人 SASAKI TAKAHIDE;TADA YOSHIYUKI;OOSHIMA AKIFUMI;YAMAZAKI HIROSHI
分类号 B23K26/00;B23K26/04;B23K26/08;B23K26/40;B28D5/00 主分类号 B23K26/00
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