| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper plating method where, when a double layer flexible copper-clad laminate in which a copper foil part and a flexible base material layer are directly stuck together without the intervention of an adhesive layer is formed, stress is not applied even when high current density plating is performed at a relatively low temperature in which an additive in a plating bath is not decomposed. SOLUTION: In the method where the temperature of a plating bath is controlled to 15 to 25°C, and copper electroplating is performed, copper foil is formed on a film so as to produce a flexible copper-clad laminate, 70 to 90% of the thickness in the copper foil is formed at a first current density, and thereafter, 30 to 10% of the thickness in the copper foil is formed at a second current density lower than the first current density. COPYRIGHT: (C)2007,JPO&INPIT
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