| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device, preventing metal chips and dust from intensively adhering to a workpiece without always bringing a polishing wheel into contact with the workpiece. SOLUTION: This polishing device 1 includes: a chuck table 202 holding a semiconductor wafer 5; and the polishing wheel 302 for polishing the semiconductor wafer 5 placed on the chuck table 202, wherein the diameter R<SB>1</SB>of the polishing wheel 302 is larger than the diameter R<SB>2</SB>of the semiconductor wafer 5, and the outer edge part of the semiconductor wafer 5 and the outer edge part of the polishing wheel 302 are disposed in alignment with each other. The diameter R<SB>1</SB>of the polishing wheel 302 and the diameter R<SB>2</SB>of the semiconductor wafer 5 satisfy the expression: 1.5≤R<SB>1</SB>/R<SB>2</SB>≤2.0, the grinding wheel 302 is provided with a recessed part 302b having a diameter D satisfying the expression:2R<SB>2</SB>-R<SB>1</SB>≤D≤R<SB>1</SB>-R<SB>2</SB>concentrically with the grinding wheel 302. Thus, metal chips and dust are prevented from intensively adhering to the semiconductor wafer 5 without always bringing the polishing wheel 302 into contact with the semiconductor wafer 5. COPYRIGHT: (C)2007,JPO&INPIT
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