APPARATUS FOR POLISHING WAFER AND PROCESS FOR POLISHING WAFER

摘要

An apparatus for polishing a wafer and a process for polishing a wafer are provided to reduce a wafer polishing time by simplifying a wafer polishing process. A wafer polishing apparatus polishes a wafer(W) held by a carrier plate rotating around an axis by pressing and rubbing the wafer to a polishing pad(11) which is formed at a polishing platen(12) rotating around another axis different from the axis. The polishing pad is formed with a plurality of areas including a first and a second areas having hardness different from each other. Each of the first and the second areas is formed according to a distribution and/or an area ratio corresponding to a time rate or a distance rate of the wafer passing through the first and the second areas during a polishing period.