| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing high-density electronic substrates and an aggregate substrate wherein the increase of the sizes of the high-density electronic substrates as end products is prevented, by devising the disposal of the recognition marks for positioning high-density electronic components mounted on the high-density electronic substrates. SOLUTION: A first pair of recognition marks 51a, 51b and a second pair of recognition marks 61a, 61b are used for positioning respectively high-density electronic components 50, 60 mounted respectively on high-density electronic substrates 2, 3; and are so disposed that the first pair of marks sandwich the high-density electronic component 50 between them, and the second pair sandwich the electronic component 60 between them. The first pair are so applied respectively to entry and backup substrates 7a, 4 and the second pair are so applied respectively to entry and backup substrates 7b, 4 as to mount the high-density electronic components 50, 60 respectively on the substrates 2, 3, by positioning the electronic components based on these recognition marks. After mounting all the electronic components, the high-density electronic substrates 2, 3 are separately cut from a substrate 1 for assembling them. COPYRIGHT: (C)2007,JPO&INPIT
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