| 摘要 |
PROBLEM TO BE SOLVED: To measure the same electrode pad of the same wafer stably for a plurality of times when evaluating electric characteristics in a wafer. SOLUTION: A method for inspecting a semiconductor device includes a process for forming a first needle mark by allowing a probe to come into contact with an electrode pad in the electrode pad of a prescribed semiconductor chip; a process for storing information on a first needle mark position; a process for shifting the position of the probe by a prescribed amount to come into contact with the electrode pad of the prescribed semiconductor chip again, and forming a second needle mark at a position that does not overlap with the first one; a process for storing information on a second needle mark position; and a process for allowing the probe to come into contact with a position corresponding to the first and second needle mark positions in the electrode pad of the prescribed semiconductor chip in each electrode pad of a plurality of semiconductor chips, based on the position information of the prescribed semiconductor chip and the information on the first and second needle mark positions for inspecting the electric characteristics of the semiconductor chip. COPYRIGHT: (C)2007,JPO&INPIT
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